A Thick Film Chip-R Trim System
| TF-3050 Series 2 LDP10/LDP15 | |||||||
 |
Ability to trim substrates
with resistor upto 0.04" x 0.02" Capability to trim from milli-ohms (mΩ) to Mega ohms(MΩ) Twin magazines to store additional substrate & reduce machine idle time Fully redefined user friendly GUI Software (Optional) Theta adustment for clamping device for precise alignment Intelligent sensors to detect and isolate part defects |
||||||
|
|||||||
|
|||||||
 |
|||||||
| TF-3050 Series 2 J40/Y70 | |||||||
 |
Ability to trim substrates
with resistor upto 0.04" x 0.02" Capability to trim from milli-ohms (mΩ) to Mega ohms(MΩ) Twin magazines to store additional substrate & reduce machine idle time Fully redefined user friendly GUI Software (Optional) Theta adustment for clamping device for precise alignment Intelligent sensors to detect and isolate part defects |
||||||
|
|||||||
|
|||||||
|
|||||||
| TF-3050 S3 SP X30/Y70 | |||||||
 |
The TF-3050 Series 3 LEP50/60C provides high accuracy perfomance to overcome the new challanges of smaller geometrics of chip resistor trimming. Proprietary designs achieve the high accuracy mechanical positioning and ultra-stable laser beam control demanded by industry. TF-3050 S3 ultilizes vision registration theta rotation within a Windows XP operating system. These advance features are integrated with established substrate handling and automation systems. | ||||||
|
|||||||
|
|||||||
|
|||||||
| TF-3050 S3 LEP50/60C/70 | |||||||
 |
The TF-3050 Series 3 LEP50/60C provides
high accuracy perfomance to overcome the new challanges of smaller geometrics of
chip resistor trimming. Proprietary designs achieve the high accuracy mechanical
positioning and ultra-stable laser beam control demanded by industry. TF-3050 S3
ultilizes vision registration theta rotation within a Windows XP operating system.
These advance features are integrated with established substrate handling and automation
systems. |
||||||
|
|||||||
|
|||||||
|
|||||||
| TF-3050 S3 LDP10TQ/15TQ | |||||||
|
The TF-3050 Series 3 LEP50/60C provides
high accuracy perfomance to overcome the new challanges of smaller geometrics of
chip resistor trimming. Proprietary designs achieve the high accuracy mechanical
positioning and ultra-stable laser beam control demanded by industry. TF-3050 S3
ultilizes vision registration theta rotation within a Windows XP operating system.
These advance features are integrated with established substrate handling and automation
systems. |
||||||
|
|||||||
|
|||||||
|
|||||||
| TF-3050 S5 Y70/X30 | |||||||
|
Ability to trim substrates with resistor up to size of
0.04"X0.02" and (0.02"X0.01") Advance vision and motion subsystems provide dramatically improved positioning and alignment capability Capability to trim from low ohms (Ω) to Mega ohms(MΩ) Built in pattern recognition for auto-compensation & precise alignment Twin magazines to store additional substrate & reduce machine idle time Windows based User-friendly GUI Software Theta adustment for clamping device for precise alignment Intelligent sensors to detect and isolate part defects |
||||||
|
|||||||
|
|||||||
| TF-2010G Series 2 Y70 | |||||||
 |
Ability to trim substrates with resistor size of
0201(0.02"x0.01") and 01005 (0.01"x0.005") Advance vision and motion subsystems provide dramatically improved positioning and alignment capability Capability to trim from low ohms (Ω) to Mega ohms(MΩ) Built in pattern recognition for auto-compensation & precise alignment Twin magazines to store additional substrate & reduce machine idle time Windows based User-friendly GUI Software Theta adustment for clamping device for precise alignment Intelligent sensors to detect and isolate part defects |
||||||
|
|||||||
