A Thin Film Chip-R Trim System

TF-3050G S2 BL8S  
Capability to trim from (Ω) to (MΩ) Ability to trim substrate with resistors up to size(0.04"X0.02")
Substrate size available for 50mmx60mmx70mm Fully redefined
User friendly GUI Software(optional) Theta adustment for clamping device for precise alignment
Twin magazines to store addtional substrates and reduce machine idle time
 
S2 BL8S Video Slides
Run PDF Run Video Run PPT
 
TF-3050G S3 BL8S  
Ability to trim substrates with resistor upto 0.04" x 0.02"

Capability to trim from milli-ohms (mΩ) to Mega ohms(MΩ)

Twin magazines to store additional substrate & reduce machine idle time

Fully redefined user friendly GUI Software (Optional)

Theta adustment for clamping device for precise alignment

Intelligent sensors to detect and isolate part defects
 
S3 BL8S Video Slides
Run PDF Run Video Run PPT

 

Mission Statement

Its our mission to explore the opportunities -where there is a demand of Innovation & Technology - We will be there.

About Us

LaserTek Singapore Pte. Ltd. was founded in June 2003 with a capital investment of SGD 2.5 million. Our goal is to provide customers with the best solutions to achieve satisfactory results.

More Details...