A Thin Film Chip-R Trim System
TF-3050G S2 BL8S | |||||||
Capability to trim from (Ω) to
(MΩ) Ability to trim substrate with resistors
up to size(0.04"X0.02") Substrate size available for 50mmx60mmx70mm Fully redefined User friendly GUI Software(optional) Theta adustment for clamping device for precise alignment Twin magazines to store addtional substrates and reduce machine idle time |
|||||||
|
|||||||
TF-3050G S3 BL8S | |||||||
Ability to trim substrates
with resistor upto 0.04" x 0.02" Capability to trim from milli-ohms (mΩ) to Mega ohms(MΩ) Twin magazines to store additional substrate & reduce machine idle time Fully redefined user friendly GUI Software (Optional) Theta adustment for clamping device for precise alignment Intelligent sensors to detect and isolate part defects |
|||||||
|